Description
BASF Ultrafuse® PC GF30 – 700 grams
BASF Ultrafuse® PC GF30 Filament.
Ultrafuse® PC GF30 contains 30% of special glass fibers that are designed for filament making and 3D printing. With its high heat deflection temperature and good dimensional stability, Ultrafuse® PC GF30 is the right material to use in an industrial environment where good temperature resistance and high strength is needed. Its flame class rating of V0 makes PC GF30 the perfect solution for applications in the transportation industry. The resilience to UV light of Ultrafuse® PC GF30 and its low moisture uptake makes it usable for interior and exterior applications.
- V0 flame class rated
- Resilience to UV light
- Good temperature resistance
- Flame retardant
- High stiffness and strength
- Good heat deflection temperature
- High dimensional stability
- Very low moisture absorption
- Tensile Strength (MPa): 36.1 (XY) , 11.2 (ZX)
- Elongation at Break (%): 2.4 (XY) , 1.1 (ZX)
- Flexural Modulus (MPa):2690 (XY) , 3450 (XZ) , 934 (ZX)
- Impact Strength Charpy Unnotched (kJ/m2): 17.1 (XY) , 18.9 (XZ) , 3.7 (ZX)
- Impact Strength Izod Unnotched (kJ/m2): 13.9 (XY) , 17.8 (XZ) , 3.4 (ZX)
- HDT @ 0.45 MPa (°C): 134
- Nozzle Temperature: 280-330 °C
- Build Chamber Temperature: —–
- Bed Temperature: 80-100 °C
- Bed modification: PC Adhesive
- Drying Procedure: Dry the filament at 100°C for at least 5 hours
- Support Materials: —-
- Nozzle Diameter: ≥ 0.6 mm
- Print Speed: 30-60 mm/sec
To print the best possible way with BASF filaments
BASF provides you with a large range of printing profiles for their materials based on different well-known printer manufacturers like Ultimaker, Raise3D and BCN3D
View Printing Profiles Here
